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U8. Micro/Nanotechnology Unit

U8. Micro/Nanotechnology Unit

U8-S05. Deposition of thin films (Polyimide, Parylene) for the fabrication of flexible devices or encapsulation purposes (On-site&Remote) OUTSTANDING.

Deposition of thin films (Polyimide, Parylene) for the fabrication of flexible devices or encapsulation purposes (On-site&Remote) OUTSTANDING.

Deposition of Polyimide (PI-2611) via spin-coating for the fabrication of flexible free-standing structures.
Conformal deposition of Parylene (different types available)

Customer benefits

  • Possibility to access to the PI deposition system in self-service mode to adapt the process to the customer needs.
  • Different Parylene types available for deposition to match customer needs

Target customer

Research groups and SMEs

References

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U8-S06. Encapsulation or fabrication of 3D strcutures via 3D printing.

Encapsulation or fabrication of 3D strcutures via 3D printing.

Fabrication of 3D structures using a dual extrusion 3D printer that delivers high-quality, composite-ready performance – in a smaller footprint

Customer benefits

Possibility to access to the 3D printing equipment in self-service mode to adapt the process to the customer needs.

Target customer

Research groups and SMEs

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U8-E15. Dual extrusion 3D printer (Ultimaker S3, Ultimaker BV)

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U8-E14. Oven for Polyimide curing in inert conditions (Ovenvan N67, Ovan).

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U8-E13 Spin coater for Polyimide depositon (W6-650-23B, Laurell Technologies Corp.)

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U8-S04. Graphene growth services (On-site&Remote) OUTSTANDING

Graphene growth services (On-site&Remote) OUTSTANDING

CVD graphene growth on copper foils and transfer of CVD graphene to rigid/flexible substrates.

Customer benefits

Adaptable platform for electrical characterization of microelectrodes to meet customer needs

Target customer

Research groups and SMEs

References

  • Masvidal-Codina E, Illa X et al., Nature Materials 18 (2019) 280-288
  • Bonaccini Calia et al., Nature Nanotechnology 17 (2022) 301-309
  • Brosel-Oliu et al. Small (2023) 2308857
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U8-E10. Encapsulation equipment

Encapsulation equipment.

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U8-E09. Optical (SEM) and electrical (Impedance) characterization equipment

Optical (SEM) and electrical (Impedance) characterization equipment.

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U8-E08. Nanolithography equipment

Nanolithography equipment

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U8-E07. RIE and DRIE equipment

RIE and DRIE equipment.

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