• Electron-beam evaporator
Univex 450B (Oerlikon Leybold Vacuum, Germany)
Adapted for sputtering, thermal evaporation and electron beam processes.
Thin film coatings can be deposited on a wide variety of substrate materials such as: metals, plastics, semiconductors, ceramics and glass.
Substrate sizes that can be accommodated in the machine range anywhere from 1mm (any shape) up to 254mm (diameter).
Evaporation:
• The system contains two material pockets for deposition of single and multilayers.
Electron Beam Physical Vapor Deposition or EBPVD
• The system contains four material pockets for deposition of single and multilayers.
Sputtering
• DC sputtering for conducting materials. Up to 1000W
• RF sputtering for dielectric materials. Up to 600W